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NFPA 318: 半导体制作器械保护标准

放大字体  缩小字体 发布日期:2012-02-09   浏览次数:531  分享到: 分享到腾讯微博
NFPA 318: 半导体制作器械保护标准
NFPA 318: Standard for the Protection of Semiconductor Fabrication Facilities
NFPA 318: 半导体制作器械保护标准
 
1.1 Scope. This standard applies to semiconductor fabrication facilities and comparable fabrication processes, including research and development areas in which hazardous chemicals are used, stored, and handled and containing what is herein defined as a cleanroom or clean zone, or both.
 
 
Safeguard people and property in semiconductor plants and research facilities with the 2012 NFPA 318.
Up-to-date with the latest references to NFPA® codes and other documents, NFPA 318: Standard for the Protection of Semiconductor Fabrication Facilities applies to semiconductor fabrication facilities and comparable R&D areas in which hazardous chemicals are used, stored, and handled -- containing a cleanroom or clean zone or both.
Chapters cover core topics including:
·   Fire protection
·   Ventilation and exhaust systems
·   Construction
·   Chemical storage and handling
·   Hazardous gas cylinder storage and distribution
·   Bulk silane systems
·   Production and support equipment
·   Emergency control station
·   General safety precautions
·   Means of egress
Three annexes provide helpful explanatory material; additional facts about seismic protection, and production and support equipment; and informational references. Facility engineers, owners, and managers, plant safety directors, safety trainers, risk insurers, and AHJs need the latest requirements for semiconductor fabrication facilities based on industry needs, new technology, and recent experience. (Softbound, 29 pp., 2012)
 

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